SMT China - Magazine

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2010年6月刊

编辑手记 Editor's Note

科学、技术、科学方法和科学精神
Science, Technology, Scientific Method and Spirit
连绥仁

SMT China远见奖专栏 SMT China Vision Awards

第四届SMT China 远见奖评选活动圆满成功
The 4th SMT China Vision Awards Presentation

第四届SMT China 远见奖获奖名单
Winners of the 4th SMT China Vision Awards

获奖产品简介
Introduction of Winning Products

市场动态 Market Watch

3M 2010 电子元器件包装材料未来趋势研讨会
3M's Electronic Component Packaging Technology Trend Forum 2010

NEPCON 西部展六月在成都举行
NEPCONEntersWestChinaMarket to StartNewIndustry Landscape InChengdu

我的看法 My Viewpoints

Mentor Graphics：中国面临转型到高端产品的研发与生产的挑战
Migrate to R & D and Production of High End Products: Challenges China Faces

DEK：改进印刷工艺、完善配套工具、加强生产服务
DEK: Improve Printing Process, Perfect Tools and Enhance Services

Vi Technology：针对不同市场进行AOI 研发
Vi Technology: R & D in AOIs Targets Different Markets

Aleader：我们将加强在研发上的投资
Aleader: We will Invest More into in R & D

AIM：用先进的焊材满足中国市场的需要
Advanced Soldering Materials Address the Demand of Local Market

关于改进选择性焊接系统的建议
Suggestions about Improving Existing selective Soldering Ovens
何小华，联合汽车电子有限公司

封面专题 Cover Story

控制印刷工艺保障生产效率
Control the Print Process：Safeguard Productivity
Dick Johnson, DEK 印刷机公司

技术特写 Tech Features

欧盟RoHS2 即将出台
EU's RoHS 2 on the Horizon
Robert Rowland, RadiSys 公司

用可涂布锡膏进行选择焊
selective Soldering with Dispensable Solder Paste
John Vivari, Nordson EFD

免洗焊锡和助焊剂的清洗
Cleaning No-clean Solder and Flux
Harald Wack 博士、Joachim Becht 博士，Zestron 公司

技术方案 Tech Solutions

应对电子行业发展挑战的独特技术
Unique Technology to Response the Challenge in the Electronic Industry Development
John Isaac, Mentor Graphics

新的底部填充工艺能降低生产成本、提高产品可靠性
New Underfill Process Reduces Production Costs and Increases Reliability
冯铁，天津瑞科美和激光工业有限公司副总经理

SMT讲座 SMT Step by Step

第五讲：胶水/ 点胶底部填充工艺的持续优化
Step 5: Dispensing Sustaining Optimization of Underfilling Process
Dan Ashley，Asymtek

第六讲：贴片 SMT 贴片机评估选购准则
Step 6: Pick & Placement How to Chose Your Pick and Place Equipment?
薛广辉，富士康科技集团